Flow periodicity in microchannels with fin arrays: Experimental validation-Reference-Cited by-同舟云学术

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Flow periodicity in microchannels with fin arrays: Experimental validation

Published:2024-10 Issue: Volume:158 Page:111261
ISSN:0894-1777
Container-title:Experimental Thermal and Fluid Science
language:en
Short-container-title:Experimental Thermal and Fluid Science

Author:

Eneren Pinar^ORCID,Vangeffelen Arthur,Aksoy Yunus Tansu,Vetrano Maria Rosaria

Publisher

Elsevier BV

Reference71 articles.

1. The new frontier in heat transfer: Microscale and nanoscale technologies;Thome;Heat Transf. Eng.,2006

2. Interlayer cooling potential in vertically integrated packages;Brunschwiler;Microsyst. Technol.,2009

3. Evaluation of jet impingement, spray and microchannel chip cooling options for high heat flux removal;Kandlikar;Heat Transf. Eng.,2007

4. A review of high-heat-flux heat removal technologies;Ebadian;J. Heat Transfer,2011

5. Microvortex-enhanced heat transfer in 3D-integrated liquid cooling of electronic chip stacks;Renfer;Int. J. Heat Mass Transfer,2013

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