1. C.H. Chao, J.M. Li, Foam-metal heat sinks for thermal enhanced BGA package applications, in: The Eleventh International Symposium on Transport Phenomena ISTP-II, Hsinchu, Taiwan, No. 4, 1998, pp. 23–29.
2. S.F. Chou, C.H. Yang, Heat transfer characteristics of aluminum foam metal, in: Proceedings of the Sixth International Symposium on Transport Phenomena in Thermal Engineering (ISTP-VI), Seoul, Korea, 9–13 May 1993, pp. 709–714.
3. Cooling of a FCHIP Package With 100 W, 1 cm2 Chip;Lee,1993
4. Properties of ceramic foam catalyst supports: pressure drop;Richardson;Appl. Catal. A: Gen.,2000
5. Foam metal catalysts with intermediate support for deep oxidation of hydrocarbons;Pestryakov;React. Kinet. Catal. Lett.,1994