Novel low-cost high-speed optic–electric laser diode pigtail module packaging technology

Author:

Sheen Maw-Tyan,Liu C.C.,Ding Zhigang

Publisher

Elsevier BV

Subject

Electrical and Electronic Engineering,Electronic, Optical and Magnetic Materials,Atomic and Molecular Physics, and Optics,Instrumentation,Control and Systems Engineering

Reference13 articles.

1. Ceradir, “Fiber Ceramic Ferrule,” 2020 Industry Report, Dec. 2020.

2. Yuan Zhang, Wen-Fan Jiang, and Ming-Yang Chen “Numerical investigation of bend insensitive multicore optical fibers,” Optical Engineering 60(6), 2021,pp. 066109.

3. Impact analysis of dense hole-assisted structure on crosstalk and bending loss in homogeneous few-mode multi-core fibers;Xie;Opt. Express,2020

4. Analysis of thermal characteristics based on a new type diode laser packaging structure;Zhang;Opt. Eng.,2017

5. Ni Yuxi;Jing, Hongqi;Kong, Jinxia;Wang, Cuiluan;Liu, Suping;Ma, and Xiaoyu, “Thermal performance of high-power semiconductor laser packaged by ceramic submount,” Chin. J. Lumin., 37 (5), 2016, pp. 561 –566.

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