Secondary flow and thermal field dynamics in a T-junction with an upstream elbow: A POD-aided, eddy-sensitized Reynolds-stress modeling study
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference38 articles.
1. A new approach for the calculation of the cut-off resolution parameter in bridging methods for turbulent flow simulation;Basara;Int. J. Heat Fluid Flow,2018
2. Analysis of the wall shear stress in a generic aneurysm under pulsating and transitional flow conditions;Bauer;Exp. Fluids,2020
3. Thermal mixing in a T-junction: Novel CFD-grade measurements of the fluctuating temperature in the solid wall;Braillard;Nucl. Eng. Des.,2018
4. Simulations of turbulent rotating flows using a subfilter scale stress model derived from the partially integrated transport modeling method;Chaouat;Phys. Fluids,2012
5. Experiments with fluid friction in roughened pipes;Colebrook;Proc. R. Soc. Lond. Ser. A Math. Phys. Eng. Sci.,1937
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