Combined effects of the filling ratio and the vapour space thickness on the performance of a flat plate heat pipe

Author:

Lips Stéphane,Lefèvre Frédéric,Bonjour Jocelyn

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference16 articles.

1. M. Lallemand, F. Lefèvre, Micro/mini heat pipes for the cooling of electronic devices, in: Proceedings of the 13th International Heat Pipe Conference, Shanghaï, China, 2004, pp. 12–22.

2. Micro- and miniature heat pipes – electronic component coolers;Vasiliev;Appl. Therm. Eng.,2008

3. A one-dimensional model of a micro-heat pipe during steady-state operation;Longtin;J. Heat Transfer,1994

4. Effect of interfacial phenomena on evaporative heat transfer in micro-heat pipes;Sartre;Int. J. Therm. Sci.,2000

5. Investigation of a wire plate micro-heat pipe array;Launay;Int. J. Therm. Sci.,2004

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