Author:
Hsieh Cheng-Chieh,Yao Shi-Chune
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference16 articles.
1. K.A. Park, A.E. Bergles, Boiling heat transfer characteristics of simulated microelectronic chips with detachable heat sinks, in: Proceedings of 8th International Heat Transfer Conference, 1986, p. 4.
2. Boiling of FC-72 on silicon chips with micro-pin-fins and submicron-scale roughness;Honda;J. Heat Transfer,2002
3. Heat sink optimization with application to microchannels;Knight;IEEE Trans. Components, Hybrids, Manufact. Technol.,1992
4. High flux boiling in low flow rate, low pressure drop mini-channel and micro-channel heat sinks;Bower;Int. J. Heat Mass Transfer,1994
5. Enhancement of single-phase heat transfer and critical heat flux from an ultra-high-flux simulated microelectronic heat source to a rectangular impinging jet of dielectric liquid;Wadsworth;J. Heat Transfer,1992
Cited by
128 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献