1. A. Naeemi, J.D. Meindl, An upper limit for aggregate I/O interconnect bandwidth of GSI chips constrained by power dissipation, in: Proceedings of IEEE International Interconnect Technology Conference, San Francisco, CA, 2004, pp. 157–159.
2. High-end server low-temperature cooling;Schmidt;IBM J. Res. Dev.,2002
3. Assessment of high-heat-flux thermal management schemes;Mudawar;IEEE Trans. Compon. Packaging Technol.,2001
4. Heat and mass transfer between impinging gas jets and solid surfaces;Martin;Adv. Heat Transfer,1977
5. L.M. Jiji, Z. Dagan, Experimental investigation of single-phase multi-jet impingement cooling of array of microelectronic heat sources, in: Proceedings of International Symposium on Cooling Technology for Electronic Equipment, Honolulu, HI, 1987, pp. 265–283.