Pool boiling heat transfer enhancement on the hybrid surfaces coupling capillary wick and minichannels
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference40 articles.
1. Research on passive cooling of electronic chips based on PCM: a review;Hua;J. Mol. Liq.,2021
2. Enhanced pool boiling of dielectric and highly wetting liquids – a review on surface engineering;Sajjad;Appl. Therm. Eng.,2021
3. A review on fabrication and pool boiling enhancement of three-dimensional complex structures;Sun;Renew. Sustain. Energy Rev.,2022
4. Boiling heat transfer mechanism of environmental-friendly refrigerants: a review;Lv;Int. J. Refrig.,2022
5. A review of two-phase submerged boiling in thermal management of electronic cooling;Fan;Int. J. Heat Mass Transf.,2020
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