Large eddy simulation of pulsed film cooling with vortex generators
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference59 articles.
1. Effects of hole geometry and density on three-dimensional film cooling;Goldstein;Int. J. Heat Mass Transf.,1974
2. Heat transfer—a review of 2002 literature;Goldstein;Int. J. Heat Mass Transf.,2005
3. Thermal barrier coatings for gas-turbine engine applications;Padture;Science (80-.),2002
4. An experimental study of round jets in cross-flow;Kelso;J. Fluid Mech.,1996
5. Vortical structure in the wake of a transverse jet;Fric;J. Fluid Mech.,1994
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