A 3D inlet distributor employing copper foam for liquid replenishment and heat transfer enhancement in microchannel heat sinks-Reference-Cited by-同舟云学术

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A 3D inlet distributor employing copper foam for liquid replenishment and heat transfer enhancement in microchannel heat sinks

Published:2020-08 Issue: Volume:157 Page:119934
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Hong Sihui,Dang Chaobin,Hihara Eiji

Funder

Japan Society for the Promotion of Science

Japan Science and Technology Agency

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference39 articles.

1. Heat transfer model for evaporation in micro channels. Part I: presentation of the model;Thome;Int. J. Heat Mass Transf.,2004

2. Microscale study of mechanisms of heat transfer during flow boiling in a microchannel;Bigham;Int. J. Heat Mass Transf.,2015

3. Transient film thickness and microscale heat transfer during flow boiling in microchannels;Sun;Int. J. Heat Mass Transf.,2018

4. Capillary-driven liquid film boiling heat transfer on hybrid mesh wicking structures;Wen;Nano Energy,2018

5. The effect of liquid film evaporation on flow boiling heat transfer in a micro tube;Han;Int. J. Heat Mass Transf.,2012

Cited by 5 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Numerical study on the anisotropy in thermo-fluid behavior of triply periodic minimal surfaces (TPMS);International Journal of Heat and Mass Transfer;2023-11

2. An Experimental Investigation on the Heat Transfer Characteristics of Pulsating Heat Pipe with Adaptive Structured Channels;Energies;2023-10-07

3. Flow Boiling Heat Transfer of Grooved Copper Foam with Open Gap;Engineering Technologies and Systems;2022-09-30

4. Enhanced flow boiling heat transfer and suppressed boiling instability in counter-flow stepped microchannels;International Journal of Heat and Mass Transfer;2022-09

5. Improved two-phase flow boiling in a minichannel heat sink for thermal management of information and communication technology (ICT) equipment;Applied Thermal Engineering;2020-11

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