1. Gallium nitride as an electromechanical material;Rais-Zadeh;J. Microelectromech. Syst.,2014
2. Embedded cooling for wide bandgap power amplifiers: a review;Bar-Cohen;J. Electron. Packag.,2019
3. G. David Via, GaN reliability-where we are and where we need to Go, n.d.
4. Z. He, Y. Yan, Z. Zhang, Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review, Energy 216 (2021). https://doi.org/10.1016/j.energy.2020.119223.
5. IEEE Staff, 2013 IEEE compound semiconductor integrated circuit symposium (CSICS)., IEEE, 2013.