1. A novel thermal management scheme for 3D-IC chips with multi-cores and high power density;Ding;Appl. Therm. Eng.,2020
2. Cramming more components onto integrated circuits;Moore;Proc. IEEE,1998
3. A review of cooling in microchannels;Tullius;Heat Transfer Eng.,2011
4. Study On Thermal Characteristics of IGBT Package modules, Master;Pan,2013
5. Status and progress of electronic cooling technologies;Ying;Guangdong Huagong,2013