Effect of copper foam thickness on pool boiling heat transfer of HFE-7100-Reference-Cited by-同舟云学术

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Effect of copper foam thickness on pool boiling heat transfer of HFE-7100

Published:2020-05 Issue: Volume:152 Page:119547
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Manetti Leonardo Lachi,Moita Ana Sofia Oliveira Henriques,de Souza Reinaldo Rodrigues,Cardoso Elaine Maria

Funder

National Council of Technological and Scientific Development of Brazil

FAPESP

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference50 articles.

1. Advances in liquid metal science and technology in chip cooling and thermal management;Yang;Adv. Heat Transf.,2018

2. A critical review of pool and flow boiling heat transfer of dielectric fluids on enhanced surfaces;Leong;Appl. Therm. Eng.,2017

3. Immersion cooling nucleate boiling of high power computer chips;El-Genk;Energy Convers. Manage.,2012

4. Review of pool boiling enhancement by surface modification;Liang;Int. J. Heat Mass Transf.,2019

5. Empirical and modeling-based correlations for pool boiling on microstructured surfaces;Teodori;Interfacial Phenom. Heat Transf.,2014

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