Twice-topology optimized heat sinks for enhanced heat transfer performance: Numerical and experimental investigation-Reference-Cited by-同舟云学术

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Twice-topology optimized heat sinks for enhanced heat transfer performance: Numerical and experimental investigation

Published:2024-12 Issue: Volume:234 Page:126126
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Li Chun-Hui,Liu Huan-Ling,Shao Xiao-Dong,Wu Jing-Peng,Li Chong-Chong,Zhu Ming-Liang^ORCID,Xie Gongnan

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference58 articles.

1. Thermal management and temperature uniformity enhancement of electronic devices by micro heat sinks: a review;He;Energy,2021

2. A critical review of traditional and emerging techniques and fluids for electronics cooling;Sohel Murshed;Renew. Sustain. Energy Rev.,2017

3. Thermal analysis and experimental verification on double-layer microchannel heat sinks with impact jet nested arrays;Shen;Int. J. Heat Mass Transf.,2023

4. Topology optimized novel additively manufactured heat sink: experiments and numerical simulations;Ning;Energy Convers. Manag.,2023

5. Enhancement of heat transfer on micro- and macro- structural surfaces in close-loop R410A flashing spray cooling system for heat dissipation of high-power electronics;Zhou;Appl. Therm. Eng.,2023

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