Effective thermal conductivity simulations of suspensions containing non-spherical particles in shear flow
Author:
Funder
Deutsche Forschungsgemeinschaft
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference38 articles.
1. Thermal conductivity of suspensions in shear flow fields;Shin;Int. J. Heat Mass Transf.,2000
2. Shear-rate dependent effective thermal conductivity of H2O+SiO2 nanofluids;Sun;Phys. Fluids,2013
3. Influence of high shear on the effective thermal conduction of spherical micro- and nanoparticle suspensions in view of particle rotation;Shu;Int. J. Heat Mass Transf.,2021
4. A Treatise on Electricity and Magnetism;Maxwell,1881
5. Effective thermal conductivity of particulate composites with interfacial thermal resistance;Nan;J. Appl. Phys.,1997
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