Optimal design of finned surface structures to reduce thermal contact resistance-Reference-Cited by-同舟云学术

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Optimal design of finned surface structures to reduce thermal contact resistance

Published:2024-08 Issue: Volume:228 Page:125638
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Zhang Bo^ORCID,Li Zhen,Zhang Xing

Publisher

Elsevier BV

Reference34 articles.

1. Principles of loop thermosyphon and its application in data center cooling systems: a review;Ding;Renew. Sustain. Energy Rev.,2021

2. A review of thermal management for Li-ion batteries: prospects, challenges, and issues;Shahjalal;J. Energy Storage,2021

3. Research progress of the liquid cold plate cooling technology for server electronic chips: a review;Zhou;Int. J. Energy Res.,2022

4. Thermal contact conductance; theoretical considerations;Mikić;Int. J. Heat Mass Transf.,1974

5. Numerical study on thermal contact resistance of 8-harness satin woven pierced composite;Ren;Int. J. Therm. Sci.,2021

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