Characterization of dynamics and heat transfer in electro-spray at elevated flow rates-Reference-Cited by-同舟云学术

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Characterization of dynamics and heat transfer in electro-spray at elevated flow rates

Published:2024-07 Issue: Volume:226 Page:125473
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Shao Yice,Wang Jiang,Wang Hong^ORCID,Zhou Xin,Xie Zhenting,Zhu Xun,Ding Yudong,Chen Rong,Liao Qiang

Funder

Foundation for Innovative Research Groups of the National Natural Science Foundation of China

National Natural Science Foundation of China

Publisher

Elsevier BV

Reference28 articles.

1. Chip-level thermal management in GaN HEMT: critical review on recent patents and inventions;Abdullah;Microelectron. Eng.,2023

2. Thermal management and packaging of wide and ultra-wide bandgap power devices: a review and perspective;Qin;J. Phys. D-Appl. Phys.,2023

3. Thermoelectric coolers for on-chip thermal management: materials, design, and optimization;Chen;Mater. Sci. Eng. R-Rep.,2022

4. Silicon carbide converters and MEMS devices for high-temperature power electronics: a critical review;Guo;Micromachines,2019

5. Enhancement of forced-convection cooling of multiple heated blocks in a channel using porous covers;Huang;Int. J. Heat Mass Transf.,2005

Cited by 1 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Mechanisms of electrospray jet formation and atomized droplet motion in pulsed-jet mode;Physics of Fluids;2024-08-01

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