Modeling and investigation of fluid flow affecting thermal boundary conductance at the solid-fluid interface-Reference-Cited by-同舟云学术

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Modeling and investigation of fluid flow affecting thermal boundary conductance at the solid-fluid interface

Published:2023-10 Issue: Volume:213 Page:124333
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Li Shanchen,Lu Chenchen,Zhang Chao^ORCID,Li Zhihui,Zhao Junhua,Chen Jige,Wei Ning^ORCID

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference50 articles.

1. The study of heat tranfer in helium II;Kapitza;J. Phys.,1941

2. Kapitza resistance;Pollack;Rev. Mod. Phys.,1969

3. Thermal boundary resistance;Swartz;Rev. Mod. Phys.,1989

4. Interfacial thermal resistance: past, present, and future;Chen;Rev. Mod. Phys.,2022

5. Emerging challenges and materials for thermal management of electronics;Moore;Mater. Today,2014

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