A molecular dynamics study on thermal conductivity of thin epoxy polymer sandwiched between alumina fillers in heat-dissipation composite material
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference48 articles.
1. Investigation of thermal management materials for automotive electronic control units;Mallik;Appl. Thermal Eng.,2011
2. Advanced Materials for Thermal Management of Electronic Packaging;Tong,2011
3. The changing automotive environment: high-temperature electronics;Johnson;IEEE Trans. Electro. Pack. Manuf.,2004
4. Thermally conductive polymer composites for electronic packaging;Lu;J. Appl. Polym. Sci.,1997
5. Thermal conductivity of polymers filled with particulate solids;Sundstrom;J. Appl. Polym. Sci.,1972
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