Author:
Hong Sihui,Dang Chaobin,Hihara Eiji
Funder
Japan Society for the Promotion of Science
Japan Science and Technology Agency
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference35 articles.
1. Review and projections of integrated cooling systems for three-dimensional integrated circuits;Kandlikar;Trans. ASME, J. Electronic Packag.,2014
2. F. Yang, M.D. Schultz, P.R. Parida, E.G. Colgan, B. Dang, G. McVicker, T. Chainer, Boiling sensitivity analysis of asymmetrically heated micro-scale devices, in: Proc. 15th IEEE Intersoc. Conf. Thermal Thermomech. Phenomena Electron. Syst. (ITHERM), May/Jun. 2016, pp. 1409–1414.
3. Challenges and opportunities for thermal management of information and communications technologies equipment: a telecommunications perspective;Salamon;IEEE Trans. Compon., Packag. Manuf. Technol.,2017
4. Enhanced flow boiling in silicon nanowire-coated manifold microchannels;Wang;Appl. Therm. Eng.,2019
5. A hierarchical manifold microchannel heat sink array for high-heat-flux two-phase cooling of electronics;Drummond;Int. J. Heat Mass Transf.,2018
Cited by
18 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献