Force analysis and bubble dynamics during flow boiling in silicon nanowire microchannels
Author:
Funder
NASA
National Science Foundation
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference61 articles.
1. State of the art of high heat flux cooling technologies;Agostini;Heat Transfer Eng.,2007
2. Cooling of photovoltaic cells under concentrated illumination: a critical review;Royne;Solar Energy Mater. Solar Cells,2005
3. A microjet array cooling system for thermal management of high-brightness LEDs;Xiaobing;IEEE Trans. Adv. Packag.,2007
4. Microreaction engineering – is small better?;Jensen;Chem. Eng. Sci.,2001
5. A microfluidic device for conducting gas–liquid–solid hydrogenation reactions;Kobayashi;Science,2004
Cited by 41 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Experimental research on cooling performances of radial expanding-channeled heat sinks applied for multiple heat sources;Applied Thermal Engineering;2024-01
2. Effect of mixed wettability surfaces on flow boiling heat transfer at subatmospheric pressures;Applied Thermal Engineering;2024-01
3. Numerical Simulation of Subcooled Flow Boiling in a Threaded Tube and Investigation of Heat Transfer and Bubble Behavior;Energies;2023-07-31
4. A novel integrated PDB-FDB model for the prediction of flow boiling heat transfer under high sub-cooling and very high heat flux conditions;International Journal of Heat and Mass Transfer;2023-07
5. Effects of surface wettability on bubble departure and critical heat flux: A parametric study based on 3-D dynamic force analysis model;International Journal of Thermal Sciences;2023-04
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3