Reduction of solid–solid thermal boundary resistance by inserting an interlayer
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference19 articles.
1. Nanoscale thermal transport;Cahill;J. Appl. Phys.,2003
2. Roles of atomic restructuring in interfacial phonon transport;Shin;Phys. Rev. B,2010
3. Electronic properties of semiconductor interfaces;Mönch;Springer Ser. Surf. Sci.,2004
4. Kapitza thermal resistance between a metal and a nonmetal;Mahan;Phys. Rev. B,2009
5. Thermal conductance of interfaces between highly dissimilar materials;Lyeo;Phys. Rev. B,2006
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