Author:
Asthana Ashish,Zinovik Igor,Weinmueller Christian,Poulikakos Dimos
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference28 articles.
1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
2. H.R. Upadhye and S.G. Kandlikar, Optimization of microchannel geometry for direct chip cooling using single phase heat transfer, in: Proceedings of the Second International Conference on Microchannel and Minichannels (ICMM2004), (2004).
3. E.G. Colgan et al., A practical implementation of silicon microchannel coolers for high power chips, Invited paper presented at IEEE Semi-Therm 21, San Jose, 2005, pp. 1–7.
4. Ultra-high critical heat flux (CHF) for subcooled water flow boiling-I: CHF data and parametric effects for small diameter tubes;Mudawar;Int. J. Heat Mass Transfer,1999
5. High flux heat removal with microchannel – a roadmap of challenges and opportunities;Kandlikar;Heat Transfer Eng.,2005
Cited by
67 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献