Coupled heat conduction and multiphase change problem accounting for thermal contact resistance
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference31 articles.
1. Transient heat conduction in one-dimensional composite slab. A natural analytic approach;De Monte;Int. J. Heat Mass Transfer,2000
2. An analytic approach to the unsteady heat conduction processes in one-dimensional composite media;De Monte;Int. J. Heat Mass Transfer,2002
3. Unsteady heat conduction in two-dimensional two slab-shaped regions. exact closed-form solution and results;De Monte;Int. J. Heat Mass Transfer,2003
4. Analytical solution to transient heat conduction in polar coordinates with multiple layers in radial direction;Singh;Int. J. Thermal Sci.,2008
5. Analytical solution to transient asymmetric heat conduction in a multilayer annulus;Jain;J. Heat Transfer,2009
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