Influencing factors of thermal contact conductance between TC4/30CrMnSi interfaces-Reference-Cited by-同舟云学术

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Influencing factors of thermal contact conductance between TC4/30CrMnSi interfaces

Published:2015-07 Issue: Volume:86 Page:694-698
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Tang Qingyun,He Jingjing,Zhang Weifang

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference22 articles.

1. M.E. Barzelay, K.N. Tong, G.F. Holloway, Effect of pressure on thermal conductance of contact joints, NACATN-3295, May 1965.

2. M.E. Barzelay, Range of interface thermal conductance for aircraft joints, NASA TN D-426, May 1960.

3. M.E. Barzelay, K.N. Tong, G. Hollo, Thermal conductance of contacts in aircraft joints, NACATN-3167, Mar 1954.

4. D.L. Padgett, L.S. Fletcher, The thermal conductance of dissimilar metals, AIAA paper 1-6, Jan. 1982.

5. Thermal conductance of cylindrical joints – a critical review;Madhusudana;J. Thermophys. Heat Transfer,1990

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