On the effective thermal conductivity of the vapour region in vapour chamber heat spreaders-Reference-Cited by-同舟云学术

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On the effective thermal conductivity of the vapour region in vapour chamber heat spreaders

Published:2019-12 Issue: Volume:145 Page:118797
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Velardo Jason,Date Abhijit,Singh Randeep,Nihill Jack,Date Ashwin,Phan Thanh Long

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference35 articles.

1. The way we were and are going on cooling high power processors in the industries;Mochizuki;Fujikura Tech. Rev.,2007

2. Experimental investigation of a vapour chamber heat spreader with hybrid wick structure;Velardo;Int. J. Therm. Sci.,2019

3. Numerical analysis and experimental verification on thermal fluid phenomena in a vapor chamber;Koito;Appl. Therm. Eng.,2006

4. Fundamental experiments and numerical analyses on heat transfer characteristics of a vapor chamber (effect of heat source size);Koito;JSME Int J., Ser. B,2006

5. Influence of a sintered central column on the thermal hydraulic performance of a vapor chamber: a numerical analysis;Lu;Appl. Therm. Eng.,2016

Cited by 21 articles. 订阅此论文施引文献订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献

1. Silicon-based microscale-oscillating heat pipes for high power and high heat flux operation;Applied Physics Letters;2024-07-08

2. Visualization Experimental Study on the Boiling Characteristics of Vapor Chamber Evaporator Surface with Different Heat Sources;2024

3. Enhanced capillary performance of hierarchical dendritic copper surface for ultrathin heat-spreading devices;Physics of Fluids;2023-07-01

4. Effect of gas channel width on the performance of vapor chambers;Sixth International Conference on Intelligent Computing, Communication, and Devices (ICCD 2023);2023-06-16

5. High-performance electrodeposited copper wicks for heat-spreading vapor chambers;Applied Thermal Engineering;2023-06

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