Computation of thermal properties of a copper–copper nano interface structure using a MD–ISE–FE method-Reference-Cited by-同舟云学术

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Computation of thermal properties of a copper–copper nano interface structure using a MD–ISE–FE method

Published:2014-11 Issue: Volume:78 Page:45-49
ISSN:0017-9310
Container-title:International Journal of Heat and Mass Transfer
language:en
Short-container-title:International Journal of Heat and Mass Transfer

Author:

Yang Ping,Fan Haibiao,Zhang Liqiang,Tang Yunqing

Funder

National Natural Science Foundation of China

Jiangsu Province Science Foundation

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference32 articles.

1. Multiscale investigation of graphene layers on 6H-SiC (0001);Tiberj;Nanoscale Res. Lett.,2011

2. Multiscale modeling and simulation of nanotube-based torsional oscillators;Xiao;Nanoscale Res. Lett.,2007

3. Computational modeling of curvature effects in supported lipid bilayers;Matthew;Curr. Nanosci.,2011

4. Hot topic: multiscale modeling of biomembrane interactions with nano-objects;Lev;Curr. Nanosci.,2011

5. Multiscale simulation of indentation, retraction and fracture processes of nanocontact;Mei;Nanoscale Res. Lett.,2010

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1. A Theoretical Review on Interfacial Thermal Transport at the Nanoscale;Small;2017-12-11

2. Heat transfer regulation of hole defect graphene by nitrogen doping;Applied Physics A;2015-09-11

3. Experimental approach on interfacial properties for Cr/Al double nanometer films under different temperature environment mode;Composite Interfaces;2015-03-19

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