Thermal optimization of plate-fin heat sinks with variable fin thickness

Author:

Kim Dong-Kwon,Jung Jaehoon,Kim Sung Jin

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference7 articles.

1. A. Bar-Cohen, Thermal management of electric components with dielectric liquids, in: J.R. Lloyd, Y. Kurosaki (Eds.), Proceedings of ASME/JSME Thermal Engineering Joint Conference, vol. 2, 1996, pp. 15–39.

2. Thermal management of electronic equipment: a review of technology and research topics;Nakayama;Appl. Mech. Rev.,1986

3. Heat sink optimization with application to microchannels;Knight;IEEE Trans. Compon. Hybrids Manuf. Technol.,1992

4. Numerical optimization of the thermal performance of a microchannel heat sink;Ryu;Int. J. Heat Mass Transfer,2002

5. Closed-form correlations for thermal optimization of microchannels;Kim;Int. J. Heat Mass Transfer,2007

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