Water evaporation in parallel plates
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference30 articles.
1. Evaporation from a two-dimensional extended meniscus;Potash;Int. J. Heat Mass Transfer,1972
2. Influence of dispersion forces on phase equilibria between thin liquid films and their vapour;Stephan;Int. J. Heat Mass Transfer,2002
3. Disjoining pressure effects in ultra-thin liquid films in micropassages—comparison of thermodynamic theory with predictions of molecular dynamics simulations;Carey;J. Heat Transfer,2006
4. On the transition between a wetting film and a capillary meniscus;Renk;J. Colloid Interface Sci.,1978
5. Analysis of the heat transfer coefficient of grooved heat pipe evaporator walls;Stephan;Int. J. Heat Mass Transfer,1992
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