The heat transfer characteristics of liquid cooling heatsink containing microchannels

Author:

Chiu Han-Chieh,Jang Jer-Huan,Yeh Hung-Wei,Wu Ming-Shan

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference22 articles.

1. High-performance heatsinking for VLSI;Tuckermann;IEEE Electronic Device Lett.,1981

2. D.B. Tuckermann, R.F.W. Pease, Ultrahigh thermal conductance microstructures for integrated circuits, in: IEEE Proc. 32nd Electronics Conference, 1982, pp. 145–149.

3. Microchanneled structures;Hoopman;ASME DSC,1990

4. Experimental investigation of heat transfer in flat plates with rectangular microchannels;Peng;Int. J. Heat Mass Transfer,1995

5. Friction flow characteristics of water flowing through rectangular microchannels;Peng;J. Exp. Heat Transfer,1995

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