Funder
National Science Foundation Industry/University Cooperative Research Center at Purdue University
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference37 articles.
1. Recent advances in vapor chamber transport characterization for high-heat-flux applications;Weibel;Adv. Heat Transfer,2013
2. A flat heat pipe architecture based on nanostructured titania;Ding;J. Microelectromech. Syst.,2010
3. Thin flexible thermal ground planes: fabrication and scaling characterization;Lewis;J. Microelectromech. Syst.,2015
4. Patterning the condenser-side wick in ultra-thin vapor chamber heat spreaders to improve skin temperature uniformity of mobile devices;Patankar;Int. J. Heat Mass Transf.,2016
5. Y. Zhao, C.-L. Chen, An investigation of evaporation heat transfer in sintered copper wicks with microgrooves, in: 2006 ASME International Mechanical Engineering Congress and Exposition, (IMECE 2006), Chicago, IL, USA, 2006, pp. 177–181.
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