Author:
Kewalramani Gagan V.,Hedau Gaurav,Saha Sandip K.,Agrawal Amit
Funder
Council of Scientific and Industrial Research, New Delhi, India
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference28 articles.
1. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
2. Heat Transfer and Fluid Flow in Minichannels and Microchannels;Kandlikar,2005
3. Thermally developing flow and heat transfer in rectangular microchannels of different aspect ratios;Lee;Int. J. Heat Mass Trans.,2006
4. Modeling of microchannel heat sinks for electronic cooling applications using volume averaging approach;Kewalramani;Int. J. Heat Mass Transf.,2017
5. R.J. Phillips, L.R. Glicksman, R. Larson, Forced-convection, liquid-cooled, microchannel heat sinks. U.S. Patent No. 4894709, 1990.
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