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Novel heat transfer fluids for direct immersion phase change cooling of electronic systems

  • Published:2012-06 Issue:13-14 Volume:55 Page:3379-3385
  • ISSN:0017-9310
  • Container-title:International Journal of Heat and Mass Transfer
  • language:en
  • Short-container-title:International Journal of Heat and Mass Transfer

Author:

Warrier Pramod,Sathyanarayana Aravind,Patil Dadasaheb V.,France Stefan,Joshi Yogendra,Teja Amyn S.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference29 articles.

1. Direct liquid immersion cooling for high power density microelectronics;Simons;Electronics Cooling,1996

2. Fundamentals of Microsystems Packaging;Tummala,2001

3. An overview of liquid coolants for electronics cooling;Mohapatra;Electronics cooling,2006

4. M. Arik, A. Bar-Cohen, Ebullient cooling of integrated circuits by Novec fluids, GRC027, GE Global Research, 2002.

5. Liquid Cooling of Electronic Devices by Single-Phase Convection;Incropera,1999

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4. A review on immersion cooling of electronic systems;LOW RADIOACTIVITY TECHNIQUES 2022 (LRT 2022): Proceedings of the 8th International Workshop on Low Radioactivity Techniques;2023

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