Ladder shape micro channels employed high performance micro cooling system for ULSI

Author:

Brinda R.,Joseph Daniel R.,Sumangala K.

Publisher

Elsevier BV

Subject

Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics

Reference19 articles.

1. Comparison of heat transfer correlations for single and two-phase micro channel flows for microelectronics cooling;Riehl;IEEE,1998

2. Fundamental narrow MOSFET gate dielectric breakdown behaviors and their impacts on device performance;Tung;IEEE Trans. Electron Dev.,2005

3. Logic Packaging in the IBM 3081, Electron. News 17 (1980) 47.

4. High performance heat sinking for VLSI;Tuckerman;IEEE Electron. Lett. EDL,1981

5. Single-phase liquid friction factors in micro channels;Steinke;Int. J. Thermal Sci.,2006

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