Author:
Adewumi O.O.,Bello-Ochende T.,Meyer J.P.
Funder
NRF
TESP
University of Stellenbosch
University of Pretoria
SANERI/SANEDI
CSIR
EEDSM Hub
NAC
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference26 articles.
1. High performance heat sinking for VLSI;Tuckerman;IEEE Electron. Dev. Lett. EDL-2,1981
2. Heat sink optimization with application to micro-channels;Knight;IEEE Trans. Compon. Hybr. Manuf. Technol.,1992
3. Analytical modeling, optimization and realization of cooling devices in silicon technology;Perret;IEEE Trans. Compon. Packag. Technol.,2000
4. parametric optimization of multi-channeled heat sinks for VLSI chip cooling;Murakami;IEEE Trans. Compon. Packag. Technol.,2001
5. H.R. Upadhye, S.G. Kandlikar, Optimization of micro-channel geometry for direct chip cooling using single phase heat transfer, in: ASME Conference on Micro-channels and Mini-channels, 2004, Rochester, New York, USA.
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