Experimental characterization of a self-adaptive shape memory alloy cooling approach to regulate temperature under varying heat loads
Author:
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference34 articles.
1. E. Graef, et al., International technology roadmap for semiconductors 2.0: 2015, p. 79, 2015.
2. High-performance heat sinking for VLSI;Tuckerman;IEEE Electron Device Lett.,1981
3. Evaluation of jet impingement, spray and microchannel chip cooling options for high heat flux removal;Kandlikar;Heat Transf. Eng.,2007
4. Comparative analysis of jet impingement and microchannel cooling for high heat flux applications;Lee;Int. J. Heat Mass Transf.,1999
5. Review and projections of integrated cooling systems for three-dimensional integrated circuits;Kandlikar;J. Electron. Packag.,2014
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