Enhanced model for annular flow in micro-channel heat sinks, including effects of droplet entrainment/deposition and core turbulence
Author:
Funder
National Aeronautics and Space Administration
Publisher
Elsevier BV
Subject
Fluid Flow and Transfer Processes,Mechanical Engineering,Condensed Matter Physics
Reference81 articles.
1. Review of heat transfer technologies in electronic equipment;Yeh;J. Electronic Packaging,1995
2. Assessment of high-heat-flux thermal management schemes;Mudawar;IEEE Trans-CPMT,2001
3. High-end server low-temperature cooling;Schmidt;IBM J. Res. Dev.,2002
4. The challenge of electronic cooling: past, current and future;Chu;J. Electronic Packaging,2005
5. Parametric investigation into the effects of pressure, subcooling, surface augmentation and choice of coolant on pool boiling in the design of cooling systems for high-power density chips;Mudawar;J. Electronic Packaging,1990
Cited by 13 articles. 订阅此论文施引文献 订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. Utilization of XGBoost algorithm to predict dryout incipience quality for saturated flow boiling in mini/micro-channels;International Journal of Heat and Mass Transfer;2024-10
2. Experimental study on sub-regimes of air-water slug flow in a rectangular micro-channel;International Journal of Mechanical Sciences;2023-12
3. Theoretical modeling of heat transfer in vertical upward and downward annular flow boiling;Heat Transfer Engineering;2023-03-28
4. RECENT PROGRESS ON HEAT TRANSFER PERFORMANCE AND INFLUENCING FACTORS OF DIFFERENT MICROCHANNEL HEAT SINKS;Journal of Enhanced Heat Transfer;2023
5. Disturbance observer-Based control for microchannel cooling system;International Journal of Refrigeration;2022-09
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线，采集、加工和组织学术论文而形成的新型学术文献查询和分析系统，可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容，当前同舟云学术共收录了国内外主流学术期刊6万余种，收集的期刊论文及会议论文总量共计约1.5亿篇，并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询！咨询电话：010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3