Cutting characteristics of monocrystalline silicon in elliptical vibration nano-cutting using molecular dynamics method-Reference-Cited by-同舟云学术

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Cutting characteristics of monocrystalline silicon in elliptical vibration nano-cutting using molecular dynamics method

Published:2022-09 Issue: Volume:212 Page:111589
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Su Zhipeng,Liang Zhiqiang,Du Yuchao,Zhou Hai,Ma Yue,Qiu Tianyang,Zhao Bin,Zhou Tianfeng,Wang Xibin

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference41 articles.

1. Ultra-thin Chip Technology and Applications,2011

2. A state-of-the-art review of ductile cutting of silicon wafers for semiconductor and microelectronics industries;Arif;Int. J. Adv. Manuf. Tech.,2012

3. Prediction of critical undeformed chip thickness for ductile mode to brittle transition in the cutting of single-crystal silicon;Yao;Semicond. Sci. Tech.,2020

4. Material removal mechanisms of monocrystalline silicon under the impact of high velocity micro-particles;Basak;Wear,2010

5. Sub-surface Damage of Ultra-Thin Monocrystalline Silicon Wafer Induced by Dry Polishing;Zhang;Electron. Mater. Lett.,2020

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