Subject
Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science
Reference45 articles.
1. A Descriptor-Based Design Methodology for Developing Heterogeneous Microstructural Materials System;Xu;J. Mech. Des.,2014
2. D.B. Marchetto, D.C. Moreira, G. Ribatski. A review on polymer heat sinks for electronics cooling applications, in: Encit 2018, 17th Brazilian Congress of Thermal Sciences and Engineering, DOI: http://dx.doi.org/10.26678/ABCM.ENCIT2018.CIT18-0394.
3. Thermal conductivity, elastic modulus and coefficient of thermal expansion of polymer composites filled with ceramic particles for electronic packaging;Wong;Appl. Polymer Sci.,1999
4. A review of models for effective thermal conductivity of composite materials;Pietrak;J. Power Technol.,2015
5. Effective thermal conductivity of polymer composites: Theoretical models and simulation models;Zhai;Int. J. Heat Mass Transf.,2018
Cited by
3 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献