Coarse-grained simulation of thermal conductivity of boron nitride/epoxy composites based on DPD and SPH method-Reference-Cited by-同舟云学术

Coarse-grained simulation of thermal conductivity of boron nitride/epoxy composites based on DPD and SPH method

Published:2024-05 Issue: Volume:241 Page:113036
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Yang Xueming^ORCID,Zhang Xiaozhong,Yu Tianfu,Li Yi,Kirca Mesut^ORCID

Funder

National Natural Science Foundation of China

Publisher

Elsevier BV

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3. Templating strategies for 3D-structured thermally conductive composites: Recent advances and thermal energy applications;Yang;Prog. Mater Sci.,2022

4. Molecular dynamic study on modulating the interfacial thermal conductivity of carbon fiber/epoxy interfaces;Chauhan;Comp. Mater. Sci.,2023

5. Temperature adjustable thermal conductivity and thermal contact resistance for liquid metal/paraffin/olefin block copolymer interface material;Liu;Int. J. Therm. Sci.,2022

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