Thin film metallization by supersonic spraying of copper and nickel nanoparticles on a silicon substrate-Reference-Cited by-同舟云学术

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Thin film metallization by supersonic spraying of copper and nickel nanoparticles on a silicon substrate

Published:2015-10 Issue: Volume:108 Page:114-120
ISSN:0927-0256
Container-title:Computational Materials Science
language:en
Short-container-title:Computational Materials Science

Author:

Lee Jong-Gun,Kim Do-Yeon,Kang Byungjun,Kim Donghwan,Al-Deyab Salem S.,James Scott C.,Yoon Sam S.

Funder

Human Resources Development program

Korea Institute of Energy Technology Evaluation and Planning

Korea government Ministry of Trade, Industry and Energy

Global Frontier Program through the Global Frontier Hybrid Interface Materials

National Research Foundation of Korea

Ministry of Science, ICT & Future Planning

Deanship of Scientific Research at King Saud University

Prolific Research group

Publisher

Elsevier BV

Subject

Computational Mathematics,General Physics and Astronomy,Mechanics of Materials,General Materials Science,General Chemistry,General Computer Science

Reference48 articles.

1. Silver thick-film contacts on highly doped n-type silicon emitters: Structural and electronic properties of the interface

2. M.M. Hilali, A. Rohatgi, B. To, in: 14th Workshop on Crystalline Silicon Solar Cells and Modules, 2004, pp. 80401–83393.

3. Double screen printed metallization of crystalline silicon solar cells as low as 30μm metal line width for mass production

4. Evaluating the Large Electromigration Resistance of Copper Interconnects Employing a Newly Developed Accelerated Life‐Test Method

5. Copper metallization reliability

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