Using a novel strategy to identify the clustered regions of associations between short-term exposure to temperature and mortality and evaluate the inequality of heat- and cold-attributable burdens: A case study in the Sichuan Basin, China
Author:
Publisher
Elsevier BV
Subject
Management, Monitoring, Policy and Law,Waste Management and Disposal,General Medicine,Environmental Engineering
Reference35 articles.
1. Estimating the cause-specific relative risks of non-optimal temperature on daily mortality: a two-part modelling approach applied to the global burden of disease study;Burkart;Lancet,2021
2. Association between ambient temperature and mortality risk and burden: time series study in 272 main Chinese cities;Chen;BMJ,2018
3. Effects of climatic temperature stress on cardiovascular diseases;Cheng;Eur. J. Intern. Med.,2010
4. Temperature-mortality relationship in North Carolina, USA: regional and urban-rural differences;Choi;Sci. Total Environ.,2021
5. Heat or cold: which one exerts greater deleterious effects on health in a basin climate city? Impact of ambient temperature on mortality in chengdu, China;Cui;Int. J. Environ. Res. Publ. Health,2016
Cited by 2 articles. 订阅此论文施引文献 订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. A multiscale examination of heat health risk inequality and its drivers in mega-urban agglomeration: A case study in the Yangtze River Delta, China;Journal of Cleaner Production;2024-06
2. Exploring spatiotemporal pattern in the association between short-term exposure to fine particulate matter and COVID-19 incidence in the continental United States: a Leroux-conditional-autoregression-based strategy;Frontiers in Public Health;2023-12-22
1.学者识别学者识别
2.学术分析学术分析
3.人才评估人才评估
"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370
www.globalauthorid.com
TOP
Copyright © 2019-2024 北京同舟云网络信息技术有限公司 京公网安备11010802033243号 京ICP备18003416号-3