Modeling of Ultrasonic Vibration Trajectory and Grinding Force of Silicon Carbide Ceramics-Reference-Cited by-同舟云学术

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Modeling of Ultrasonic Vibration Trajectory and Grinding Force of Silicon Carbide Ceramics

Published:2024 Issue:01 Volume:13 Page:737-747
ISSN:2324-8696
Container-title:Modeling and Simulation
language:
Short-container-title:MOS

Author:

谢家富

Publisher

Hans Publishers

Reference10 articles.

1. Experimental studies on drilling tool load and machining quality of C/SiC composites in rotary ultrasonic machining

2. Experimental study on vibration stability in rotary ultrasonic machining of ceramic matrix composites: Cutting force variation at hole entrance

3. On understanding the microstructure of SiC/SiC Ceramic Matrix Composites (CMCs) after a material removal process

4. Dong, h., Zhang, H., Kang, R., et al. (2022) Mechanical Modeling of Ultrasonic Vibration Helical Grinding of SiCf/SiC Composites. International Journal of Mechanical Sciences, 234, Article ID: 107701.

5. Ultrasonic vibration-assisted grinding of blind holes and internal threads in cemented carbides

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