Author:
Lin Jing-Chie,Chang Ting-Kang,Yang Jen-Horn,Hwang Yean-Ren,Li Chuan
Cited by
2 articles.
订阅此论文施引文献
订阅此论文施引文献，注册后可以免费订阅5篇论文的施引文献，订阅后可以查看论文全部施引文献
1. An Effective Uniformity Improvement For Fan-Out Panel Level Packaging Electroplating;2023 18th International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT);2023-10-25
2. Electroplating Uniformity Enhancement for High Performance Fan-Out Panel Level Packaging;2023 International Conference on Electronics Packaging (ICEP);2023-04-19