Design, Fabrication, and Application of Colorless Polyimide Film for Transparent and Flexible Electronics
Author:
Chen Wenlin,Ding Hui,Yu Jianshu,Zhang Ying,Sun Xuejiao,Chen Bin,Jin Yanya,Fu Rao,Zhou Zhongfu
Abstract
Driven by the emerging development of transparent and flexible electronics, colorless polyimide (CPI) has been attracting much attention in recent years. As a key component for next generation electronics, CPI film will be well focused both on research and commercialization. In this chapter, we would like to provide a review and outlook to the field for the reference of scientists, engineers, and entrepreneurs. Topics being addressed are formulation/design, synthesis of the resin, fabrication, and characterization of the CPI films, as well as trends of the film application for the next generation of electronics. Attention will also be given to the current stage of manufacturing of CPI monomers and resin, industrial production of CPI films, etc.
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