Identification of Defects Causes: Ishikawa Diagram and 5 Whys in Theoretical and Practical Terms

Author:

Ciecińska Barbara

Abstract

The chapter briefly presents the issue of quality and its management in production. In the relevant part of the chapter, the Ishikawa diagram, its variations, and the possibility of extending its application to new areas will be discussed. Similarly, the 5 Whys method is presented. The application of the Ishikawa diagram and how to use the 5 WHYS method are presented with practical examples, enabling them to be transferred to the operation of real enterprises. These examples concern machining, laser processing, and gluing in the context of defective products and processes. The discussion includes case studies of what defects may appear in this type of (or similar, in the field of mechanical engineering) processes, a discussion of their importance in production. Ways to improve machining and assembly operations in the presented context are shown.

Publisher

IntechOpen

Reference20 articles.

1. Hoyle D. Quality Management Essentials. San Diego, CA: Elsevier; 2007

2. Kaymak H. The relationship between total quality management practices and their effects on firm performance. Journal of Operations Management. 2003;21(4):405-435

3. Chądzyńska M, Klimecka-Tatar D. Use the quality management tool which is the Ishikawa diagram on the example of a small leather business. Archives of Engineering Knowledge. 2017;2(1):20-22

4. Voehl F. 5 whys. In: The Innovation Tools Handbook. 1st ed. Vol. 2. New York, NY: Productivity Press; 2016. pp. 1-10

5. Rose KH. Project Quality Management: Why, What and How. Boca Raton, FL: J. Ross Publishing; 2005

同舟云学术

1.学者识别学者识别

2.学术分析学术分析

3.人才评估人才评估

"同舟云学术"是以全球学者为主线,采集、加工和组织学术论文而形成的新型学术文献查询和分析系统,可以对全球学者进行文献检索和人才价值评估。用户可以通过关注某些学科领域的顶尖人物而持续追踪该领域的学科进展和研究前沿。经过近期的数据扩容,当前同舟云学术共收录了国内外主流学术期刊6万余种,收集的期刊论文及会议论文总量共计约1.5亿篇,并以每天添加12000余篇中外论文的速度递增。我们也可以为用户提供个性化、定制化的学者数据。欢迎来电咨询!咨询电话:010-8811{复制后删除}0370

www.globalauthorid.com

TOP

Copyright © 2019-2024 北京同舟云网络信息技术有限公司
京公网安备11010802033243号  京ICP备18003416号-3