Author:
Yuan Guanming,Cui Zhengwei
Abstract
Nowadays, polyimide-derived graphite films with high thermal conductivity have been increasingly applied in many cutting-edge fields needing thermal management, such as highly integrated microelectronics and wireless communication technologies. This chapter first introduces a variety of functional graphite films with high thermal conductivity of 500–2000 W/m K in the planar direction, then provides the preparation technology (including lab-scale preparation and industrial production) and quality control strategy of high-thermal-conductivity graphite films, which are derived from a special polymer- polyimide (PI) by carbonization and graphitization treatments through a suitable molding press in a vacuum furnace. The morphology, microstructure and physical properties as well as the microstructural evolution and transformation mechanism of PI films during the whole process of high-temperature treatment are comprehensively introduced. The nature of PI precursor (e.g., the molecular structure and planar molecular orientation) and preparation technics (e.g., heat-treatment temperature and molding pressure) are critical factors influencing their final physical properties. Currently challenged by the emerging of graphene-based graphite films, the latest developments and future prospects of various PI-derived carbons and composites (beyond films) with high thermal conductivity have been summarized at the end. This chapter may shed light on a promising and versatile utilization of PI-derived functional carbon materials for advanced thermal management.
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