Recent Advances in Solderability of Ceramic and Metallic Materials with Application of Active Solders and Power Ultrasound-Reference-Cited by-同舟云学术

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Recent Advances in Solderability of Ceramic and Metallic Materials with Application of Active Solders and Power Ultrasound

Published:2017-11-29 Issue: Volume: Page:
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Container-title:Recent Progress in Soldering Materials
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Author:

Koleňák Roman

Publisher

InTech

Link

http://www.intechopen.com/download/pdf/56165

Reference28 articles.

1. Koleňák R, Prach M. Spájkovanie/Soldering. 1st ed. Bratislava: STU Publisher; 2015. p. 285. ISBN 978-80-227-4327-3

2. Koleňák R. Spájkovanie keramických materiálov/Soldering of ceramic materials. Zvárač/Welder. 2006;3(4):59-64. ISSN 1336-5045

3. Turwitt M. Joining of Ceramics, Glass and Metal. Düsseldorf: DVS—Verlag GmbH; 1997. p. 242

4. Ruža V, Koleňák R, Jasenák J. Spájkovanie vo vákuu/Vacuum Soldering. Trnava: SZS; 2005. p. 146. ISBN 80-969393-0-0

5. Wlosinski W. Spájane metali z niemetalami/Bonding Metals with Non-metals. Warszawa: Panstwowe Wydawnictwo Naukove; 1989. p. 259

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