Application of Imagery Modeling and Deep Learning in Chip Thermal Analysis
Author:
Affiliation:
1. School of Microelectronics Shanghai University,Shanghai,China
Publisher
IEEE
Link
http://xplorestaging.ieee.org/ielx8/10613861/10613931/10613962.pdf?arnumber=10613962
Reference14 articles.
1. Hybrid Chips may Solve Thermal Efficiency and Integration Challenges in 5G Mobile Devices;Emilio;Power Electronics News,2019
2. Thermal-Aware Fixed-Outline 3-D IC Floorplanning: An End-to-End Learning-Based Approach
3. ANSYS finite element analysis based temperature forecast method, involves constructing chip internal structure of rear entity, constructing chip internal structure using ANSYS finite element, and obtaining function relationship[C];SU;UNIV SUN YAT-SEN (UYSY-C),2015
4. Power Blurring: Fast Static and Transient Thermal Analysis Method for Packaged Integrated Circuits and Power Devices
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