Author:
Koh Meiten,Shimura Masayuki,Sekiguchi Shoya,Mishima Shoko,Ishikawa Nobuhiro,Ogata Toshiyuki
Cited by
4 articles.
订阅此论文施引文献
订阅此论文施引文献,注册后可以免费订阅5篇论文的施引文献,订阅后可以查看论文全部施引文献
1. Novel Low Df Thermosetting Film and Photo Imageable Film;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
2. A Novel Chiplet Integration Architecture Employing Pillar-Suspended Bridge with Polymer Fine-Via Interconnect;2023 IEEE 73rd Electronic Components and Technology Conference (ECTC);2023-05
3. Novel thermosetting low Dk/Df film and its performance;2022 International Conference on Electronics Packaging (ICEP);2022-05-11
4. Novel Isotropic Film for 5G Application;Transactions of The Japan Institute of Electronics Packaging;2022